Array Package Lens
Although the four-chip package satisfies the improvement of UV LED's central illuminance, due to the deviation between the chip and the optical axis, the light pattern cannot be symmetrical and uniform. For medium and long-distance irradiation applications, the lack of uniformity is fully revealed. Applications that require a high degree of uniformity such as exposure and printing are very disadvantageous.
The patented optical design of the NOVAXIL™ array lens for the four-chip package takes into account the efficiency and uniformity, and also considers the array expansion requirements of the light source module. Combined with the molding ability of the sol-gel process itself, the light intensity and uniformity are both It is the ultimate solution for four-die packaging that these mutually contradictory optical properties can be satisfied at the same time.
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NOVAXIL™ Array Lens Features
| Chip alignment | Precise alignment of the optical axis, optimized uniformity, suitable for long-distance transmission of energy |
| Independent optics | Individual chips have independent lens design, and the uniformity will not be affected when the array is expanded for modular or systemetic design |
| Array structure | The energy is more concentrated, the UV illuminance in the center of the encapsulation is stronger, and the uniformity is better than regular dome lens design |
| Lens material | NOVAXIL™ High Purity Silica Glass |
| Lens size | Custom specification |
| Applicable packages | 6565 / 6868 |
| Angle selection | 30° |
| UV transmittance | UVA > 92%; UVC > 90% (for UVC grade) |
| Maximum temperature resistance | 1,000 °C |
The uniformity drop caused by traditional four-chip packaging during long-distance transmission, the right figure clearly shows discrete light spots and central dark areas, resulting in four-chip packaging only suitable for close-range applications
The design of NOVAXIL™ array lens takes into account the requirements of four-chip packaging for illumination and uniformity, and perfectly solves the practical problem of four-chip packaging for long-distance illumination spot dispersion